Intel recently issued a notice that its Centrino 2 notebook platform (Montevina) will launch on July 15 in Taiwan. Industry players that form the platform's supply chain in Taiwan are all gearing up in order to fulfill Intel's forecast of a penetration rate of 30-40% by the end of the third quarter, and 50-60% by the end of the year, according to a Chinese-language Commercial Times report.
Nan Ya Printed Circuit Board (NPC), who manufactures flip-chip substrates for Intel already has its capacity fully loaded, while other Centrino 2 partners including Taiwan Semiconductor Manufacturing Company (TSMC), Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) are all ramping up shipments, noted the paper.
With Centrino 2 notebooks likely ship with 2GB memory as the baseline specification, DRAM makers are expecting the new platform to help ease the oversupply pressure in the market, added the paper.
| Intel Centrino 2 platform components and partners | ||
| Item | Detail | Partners |
| CPU | 45nm Penryn processor | NPC (FC substrates) |
| Northbridge chipset | GM45 and PM45 (Cantiga) | NPC (FC substrates) |
| Southbridge chipset | ICH9 | ASE and SPIL (packaging and testing) |
| Memory | DDR2 and DDR3 | PSC, ProMOS, Nanya, A-Data and Transcend (DRAM) |
| Wireless | 802.11 a/b/g/n and WiMAX (Echo Peak or Shirley Peak) | TSMC and ASE (foundry) USI and Gemtek (module) Ralink and Realtek (11n chip) |
| Turbo Memory | 2-4GB | PTI (packaging and testing) Foxconn, A-Data and Transcend (module) |
Source: Commercial Times, compiled by Digitimes, July 2008
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